Washington, D.C. (December 14, 2010) — The manufacturing of semiconductor wafers used in all types of electronics involves etching small features onto a wafer with lasers, a process that is ultimately limited by the wavelength of the light itse…
WEST LAFAYETTE, Ind. – Researchers at Purdue University are studying the effects of fire on steel structures, such as buildings and bridges, using a one-of-a-kind heating system and a specialized laboratory for testing large beams and other com…
WEST LAFAYETTE, Ind. – A study by researchers at Purdue University suggests that some high school football players suffer undiagnosed changes in brain function and continue playing even though they are impaired.
“Our key finding is a previously …
Researchers have made a discovery that may lead to the development of an innovative liquid-cooling system for future computer chips, which are expected to generate four times more heat than today’s chips. Researchers had thought that bubbles might block the circulation of liquid forced to flow through “microchannels” only three times the width of a human hair. Engineers also thought that small electric pumps might be needed to push liquid through the narrow channels, increasing the cost and complexity while decreasing the reliability of new cooling systems for computers. Purdue researchers, however, have solved both of these potential engineering hurdles, developing a “pumpless” liquid-cooling system that removes nearly six times more heat than existing miniature pumpless liquid-cooling systems, said Issam Mudawar, a professor of mechanical engineering.