Tiny bubbles are key to liquid-cooled system for future computers

Researchers have made a discovery that may lead to the development of an innovative liquid-cooling system for future computer chips, which are expected to generate four times more heat than today’s chips. Researchers had thought that bubbles might block the circulation of liquid forced to flow through “microchannels” only three times the width of a human hair. Engineers also thought that small electric pumps might be needed to push liquid through the narrow channels, increasing the cost and complexity while decreasing the reliability of new cooling systems for computers. Purdue researchers, however, have solved both of these potential engineering hurdles, developing a “pumpless” liquid-cooling system that removes nearly six times more heat than existing miniature pumpless liquid-cooling systems, said Issam Mudawar, a professor of mechanical engineering.

Researchers close in on natural solution to PCB contamination

An environmentally friendly solution to one of the world’s most notorious chemical contamination problems may be a step closer to reality, reports a research team from Purdue University and the University of British Columbia. The team has identified one of the key stumbling blocks that prevent microorganisms from decomposing PCBs (polychlorinated biphenyls), a persistent and potentially hazardous industrial chemical that has become nearly ubiquitous in the environment. While capitalizing on the discovery will take time, it could eventually show researchers how to teach microorganisms to break down PCBs into ecologically safe molecules, a process known as bioremediation.