Smart heat pipe efficiently cools laptops, permitting greater speed
Evacuating heat is one of the great problems facing engineers as they design faster laptops by downsizing circuit sizes and stacking chips one above the other. The heat from more circuits and chips increase the likelihood of circuit failures as well as overly heated laps. “Space, military, and consumer applications, are all bumping up against a thermal barrier,” says Sandia researcher Mike Rightley, whose newly patented “smart” heat pipe seems to solve the problem. The simple, self-powered mechanism transfers heat to the side edge of the computer, where air fins or a tiny fan can dissipate the unwanted energy into air.